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The picosecond ultrafast laser glass cutting machine is an industrial-grade, ultra-precision cold-processing system designed for high-end precision glass, brittle materials, and the machining of complex shapes with ultra-fine holes. Leveraging picosecond ultrashort-pulse laser technology and Bessel beam "hidden cutting" (internal stealth dicing) with a long depth of focus, it achieves mirror-quality cuts—free from thermal damage, edge chipping, or micro-cracks. This technology effectively resolves industry pain points associated with traditional methods—such as mechanical wheel cutting, waterjet cutting, and standard UV laser processing—including edge chipping, material fracturing, low yields, and cumbersome workflows.
The equipment is compatible with a full range of brittle materials—including ultra-thin foldable UTG, optical quartz, sapphire, high-borosilicate glass, and tempered glass—and enables integrated precision processing for features such as ultra-micro holes, irregular contours, curved surfaces, counterbored holes, and hole arrays. It serves as a high-end, primary mass-production solution for sectors including 3C electronics, automotive displays, optical medical devices, and semiconductor precision manufacturing.
Utilizing picosecond ultrafast "cold processing" technology, the laser features pulse widths in the picosecond range; energy is released and terminated instantaneously, preventing heat conduction or accumulation and achieving a truly cold processing state. Combined with a Bessel beam-based internal filamentation modification process, the laser penetrates the entire thickness of the glass to create a uniform, layered fracture zone within the material, enabling automatic and precise separation.
The entire process involves no high-temperature burning or mechanical stress; the heat-affected zone is less than 5 μm and edge chipping is under 3 μm. The cut surface requires no grinding, polishing, or secondary cleaning—yielding a finished product in a single step—thereby significantly simplifying production workflows while enhancing product strength and yield rates.
1.Ultra-micropore precision machining capabilities
Achieving industry-leading precision in micro-hole machining, we are capable of producing ultra-micro holes as small as 5μm and stably mass-producing various precision small holes, irregular holes, micro-hole arrays, and countersunk holes ranging from 0.03mm to 6mm. The resulting holes feature smooth, vertical walls free of burrs or edge chipping, meeting the ultra-high precision standards required for optics and semiconductor applications.
2.Compatible with full-thickness glass through-cutting
Compatible with materials ranging from ultra-thin foldable glass (0.05 mm) to ultra-thick tempered glass (18.5 mm); capable of stably cutting standard float glass, ultra-clear glass, borosilicate glass, quartz glass, and sapphire, offering versatility that covers high-end glass processing applications across the entire industry.
3.Mirror-finish cutting quality
The process results in no thermal cracks, residual stress, or edge chipping; the cut surface features a mirror-like finish, and the glass exhibits significantly enhanced flexural and compressive strength. With a finished product yield of up to 99.99%, it fully meets the stringent quality standards required for high-end applications in automotive, military, and medical optics.
4.Fully automated intelligent mass production system
The system features a Grade 00 natural marble base and a magnetic levitation linear motor, achieving a positioning accuracy of ±0.002 mm. It is equipped with high-definition CCD automatic visual alignment, a vacuum suction worktable, and a dual-station alternating operation system. It supports automatic batch layout of designs and continuous, unmanned production, making it suitable for 24-hour industrial-scale manufacturing.
5.Ultra-low long-term operating costs
Utilizing a purely non-contact laser processing method, the system eliminates the need for cutting wheels, consumables, and grinding fluids—requiring only routine maintenance of water-cooling filter elements. It bypasses multiple manual steps such as edge grinding, trimming, and polishing, thereby significantly reducing labor and consumable costs for the enterprise.
• Laser Source: 355nm UV picosecond laser (15W/30W/80W options); features stable beam quality and long service life.
• Optical System: Bessel-beam cutting head with extended depth of field and 3D dynamic focusing galvanometer; ensures high consistency in deep cutting.
• Motion System: Precision granite platform and magnetic levitation linear motors; delivers high speed, high stability, and zero-jitter performance.
• Control System: Industrial-grade system dedicated to ultrafast lasers; compatible with standard CAD, DXF, and AI file formats; powered by the stable JCZ EZCAD3 platform.
• Auxiliary Systems: CCD-based automatic visual positioning, constant-temperature industrial chiller, intelligent fume purification, and automatic counting and sorting system.
1. 3C Consumer Electronics: UTG (Ultra-Thin Glass) for foldable screens, micro-drilling for mobile phone cover glass, smartwatch dials, and precision shaped cutting/drilling for tablet touch-screen glass.
2. Automotive Smart Displays: Curved glass for automotive center consoles, optical micro-drilling for AR-HUDs, tempered glass windows for instrument clusters, and automotive lens processing.
3. Optical Instruments & Medical: Quartz microscope slides, optical lenses, transparent glass for medical endoscopes, and micro-drilling for microfluidic chips.
4. Precision Semiconductor Manufacturing: Glass wafers, ultra-thin glass substrates, and precision aperture cutting for transparent windows in micro-sensors.
5. High-End Smart Appliances: High-end touch panels, smart lock glass, and precision shaped cutting for viewing windows in kitchen and bathroom appliances.
• Compared to traditional wheel cutting, waterjet cutting, and standard nanosecond UV laser cutting:
• No mechanical stress; no chipping or cracking
• No molds required; supports free programming for complex shapes and ultra-micro holes
• No thermal damage; results in higher structural strength and better stability
• Streamlined process; single-step forming yields the finished product, doubling mass production efficiency
This equipment is custom-engineered for high-end precision glass applications—including micro-holes, irregular shapes, curved surfaces, and thick plates—serving as a core solution to replace traditional processing methods and upgrade high-end automated glass production lines. With ultra-high precision, exceptional yields, and minimal operating and maintenance costs, it empowers precision glass manufacturers to achieve upgrades toward intelligent, high-end, and mass-production capabilities.
As an original manufacturer handling end-to-end R&D and production, we offer free sample testing, customization for non-standard dimensions and processing solutions, on-site installation and commissioning, and lifetime technical support—providing a one-stop solution for complex challenges in high-end precision glass cutting and drilling.
